Multiple Re-Balling Tool

● To CSP or BGA, a solder ball can be mounted easily, with mechanicale- auto- centering unit.   

   Even when it is square, a rectangle is also.  

●  Re-balling of the package from 3~to 50mm□ is possible. 

●  Solder ball's mounting, and printing of solder are also possible.

●  Ifanoptionaltoolisadded,there-  ballingofmicroballsuch as 200μｍｍФ is alsopossible.  

●  Air is required even though the power supply of RBC-1 is unnecessary. The              

  special air compressor can also be arrenged.